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    <title>半导贴吧 - CMP抛光</title>
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      <title>CMP抛光设备</title>
      <link>https://www.bdtb6666.com/thread-47-1-1.html</link>
      <description><![CDATA[CMP抛光设备是半导体晶圆表面处理的关键设备之一，‌也是目前最为普遍的半导体材料表面平坦化技术。‌
CMP设备全称为化学机械平坦化（‌Chemical Mechanical Planarization, CMP）‌设备，‌其工作过程是通过抛光头将晶圆待抛光面压抵在粗糙的抛光垫上，‌借助抛光液腐 ...]]></description>
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      <pubDate>Sat, 27 Jul 2024 19:02:12 +0000</pubDate>
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