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    <title>半导贴吧 - 模塑机</title>
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      <title>半导体模塑机工作原理</title>
      <link>https://www.bdtb6666.com/thread-304-1-1.html</link>
      <description><![CDATA[半导体模塑机（Transfer Molding Machine）是半导体封装过程中的关键设备，主要用于将芯片和引线框架等组件通过热固性材料（如环氧树脂）进行封装保护。其核心原理是通过高温高压将材料注入模具，实现精确成型的封装结构。以下是其工作原理的详细说明：[hr]‌1. 工作流 ...]]></description>
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      <pubDate>Thu, 13 Mar 2025 05:09:59 +0000</pubDate>
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