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    <title>半导贴吧 - 贴片键合机</title>
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      <title>芯片键合机</title>
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      <description><![CDATA[键合机是半导体后道封装环节的重要设备

芯片键合机（Die Bonder），又称固晶机，是半导体后道封测的芯片贴装（Die attach） 环节中最关键、最核心的设备。键合机主要用于裸芯片或微型电子组件的贴装，将 芯片安装到引线框架（Lead frame）、热沉（Heat sink）、基板（S ...]]></description>
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      <pubDate>Mon, 29 Jul 2024 13:21:01 +0000</pubDate>
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